LSM6DS33 BREAKOUT BOARD

Package includes

• LSM6DS33 Breakout board

Optional (Please select from the dropdown lists):

• Sensor
• MOLEX connector and precrimped wire, LED, transistor and passive elements

Assembled or Kit Option Choose:

• Assembled, if you want to get the breakout board with soldered parts.
• Kit, if you want to do this by yourself.

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What is it?

The LSM6DS33 is an inertial measurement unit consisting of 3 axis digital accelerometer and 3 axis digital gyroscope.

Sensor has user-selectable full scales of ±2g/±4g/±8g/±16g acceleration and ±125/±250/±500/±1000/±2000 dps angular rate speed. It is capable of output acceleration data with rates from 12.5 Hz to 6.664 kHz and angular rate speed 12.5 Hz to 1.666 kHz.

The device may be configured to generate event signals using independent inertial wake-up/free-fall/6D orientation/tap sensing/activity inactivity sensing events.

The interrupt signals can be connected to the transistor driving LED. The interrupt signal INT1 is default connected to the on-board LED. Both INT1 and INT2 are connected to the MOLEX connector.

The LSM6DS33 has an integrated 8kB buffer allowing the user to store data in order to limit intervention by the host processor.

LSM6DS33 Evaluation Module Features

• User selectable measurement ranges: acceleration ±2g/±4g/±8g/±16g, angular rate speed ±125/±250/±500/±1000/±2000 dps.
• Acceleration resolution up to 61ug/LSB
• Angular rate speed resolution up to 4.375mg/LSB
• Built-in digital High-Pass filter
• Acceleration output data rate up to 6.664 kHz
• Angular rate speed output data rate up to 1.666 kHz.
• Operating voltage 1.71-3.6V
• Supply current less than 0.2mA
• Operating temperature range -40 – 85 degC
• Interfaces: SPI (=<10MHz), I2C(=<400kHz)

Maximum non-destructive acceleration 10000g for 0.2ms

Sensor is suitable for

• Motion and free-fall detection
• Inclinometer applications
• Digital spirit level
• Vibration measurement
• Platform stabilization
• Speed measurement
• Indoor navigation
• Orientation detection

Code

Standard C platform-independent drivers for MEMS motion and environmental sensors : st.com

Android sensor HAL for MEMS motion and environmental sensors: st.com

PRODUCT DESCRIPTION

• Two layer PCB breakout board for LGA-16L (3x3x0.86mm) - Hand solder capable.
• SMD Molex socket type: 53261-08
• PCB dimensions: 22x26x1mm

FEATURES

• Small dimensions
• PCB can be screwed or glued to the object surface
• Additional transistor and LED connected to the interrupt pins
• All LIS3DH signals connected to the Molex socket
• Gerber file for the SMT stencil to download
• Sensor footprint designed for hand soldering

PINOUT

• 1 SDO – Slave Data Output
• 2 SDI – Slave Data Input
• 3 SCL – Slave Clock Input
• 4 CS – Chip Select
• 5 INT2 – Programmable Ready/Interrupt pin
• 6 INT1 – Programmable Ready/Interrupt pin
• 7 GND - Ground
• 8 3.3V – Supply Voltage

DATASHEET

ST LSM6DS33 product page

LSM6DS33 Datasheet

MECHANICAL DRAWING

ASSEMBLY DRAWING