This is a breakout board for Octavo's STM32MP1 based system in package.

The system in package is OSD32MP15x and Features:

• Integrated into a single BGA Package:
• STMicroelectronics STM32MP15x microprocessor SoC with Dual Arm® Cortex® A7 and Arm® Cortex® M4
• STPMIC1 Power Management IC (PMIC)
• up to 1GB DDR3L Memory (memory is 512MB on the dev board sip)
• 4KB Non-Volatile EEPROM
• MEMS Oscillator
• Over 100 Passives
• ST32MP15x Features:
• Arm® Cortex®-A7 up to 800MHz x2
• Arm® Cortex®-M4 up to 209MHz
• NEON™SIMD Coprocessor x2
• TrustZone®
• USB 2.0 HS + PHY x2
• Ethernet 10/100/1000
• CAN FD/TTCAN x2, UART x4, USART x4,SPI x6, I2C x6, SAI x4, QSPI, SPDIF, I2S x3
• eMMC/SD/SDIO Ports x3
• GPIO x148
• 24-bit RGB Display, MIPI DSI
• Camera Interface
• 22 Channel 16-bit ADC x2, 12-bit DAC x2
• Access to all signals of the STM32MP1 TFBGA 361 package
• STPMIC1 Power Management IC Features:
• Single Voltage Input: 2.8V-5.5V
• Integrated Boost: 5.2V
• System Power: Buck LDOx4, Power Switch x2
• 302 Ball BGA (18mm x 18mm)
• 18 x 18 grid, 1mm Pitch
• Case Temp Range: 0° to 85°C, -40° to 85°C

The breakout board features:

• Small Form Factor
• Only 3in X 1.8in (75mm X 46mm)
• Access to 106 I/O
• two 2×30 100mil (2.54mm) Headers
• Maximum flexibility to prototype designs
• Breadboard Compatible
• OSD32MP157C-512M-BAA
• STM32MP157C Dual Arm® Cortex® A7 + M4
• 512MB DDR3 Memory
• STPMIC1A Power Management
• EEPROM
• Oscillator
• Passives
• µUSB
• STLink*
• UART
• µSD Card
• 32KHz Crystal
• 4 Layer Design
• No Back Side Components

I also soldered some headers on for testing. It's a very easy to design for SIP i used for a proof of concept project but don't need the dev kit anymore.