Features

• ANSI/VITA 57.1 compliant

• Commercial grade form factor

• High-pin count (HPC) connectors

• Low-pin count (LPC) breakout pads

• Breakout of carrier card connector

• Breakout of mezzanine card connector

• Stackable assembly

• Separate breakout of power pins

• Breakout pads with 1.27 mm pitch

• Prototyping area with 2.54 mm grid

• Open-source hardware

Applications

• Easy prototyping

• Testing and debugging of FMC boards

• Research and education with FPGAs

Description

The FMC HPC to LPC Breakout board is a passive adapter for accessing the LPC signals of ANSI/VITA 57.1 FPGA Mezzanine Card (FMC) Standard compliant high-pin count (HPC) connectors. The board has two high-pin count (HPC) connectors. All HPC signals are plated through from the top to bottom connector. This means that the breakout board can be used with all combinations of HPC and LPC carrier boards and mezzanine cards. All pins of the connector's rows C, D, G, and H are routed to a separate pad array on the top and bottom side. These pads were placed at a 1.27 mm pitch to easily attach additional probes or solder wires. For special measuring tasks or for use as a stand-alone carrier, the power pins of the connector were routed to additional vias in the back of the module. Furthermore, simple electrical circuits can be realized on the prototyping area, which is a field of non connected vias with a pitch of 2.54 mm. The FPGA mezzanine card has commercial grade form factor (single width, 78.80 mm x 69 mm) and is designed for air cooling.

Find more resources at FMCHUB.COM

The full datasheet is available at https://fmchub.github.io/projects/FMC_HPC_TO_LPC_BREAKOUT/Datasheet/FMC_HPC_TO_LPC_BREAKOUT_datasheet.html