About

The purpose of this FPC is to expose the necessary lines in the BGA 153 EMMC chip

How does it work

The FPC was made to sit underneath the EMMC chip maintaining integrity and longevity of connections

Requirements

The necessary equipment to reball EMMC. The necessary experience and skill to solder small components. SMD Resistors size 0603

Procedure

• Before starting, you need to "ink mask" some NC points on the stencil to leave enough room for FPC

Please refer to diagram below

• After reballing EMMC, peal the adhesive strip from FPC and place it correctly according to diagram
• Place EMMC according to indicators and start heating the chip
• Gently press down the chip to make proper connections - the is necessary as there is a large gap between the solder balls and pads due to irregularities in the surface of FPC -

Tips

• Use 183C solder balls/paste that significantly reduces exposing EMMC to high heat
• Make sure there is no debris sitting between solder balls before reflowing

Application

FPC was specifically designed around the Nintendo Switch OLED but can be used anywhere where critical data lines is not readily exposed on top layer of the PCB.