The ROCK 3 Compute Module (CM3) is an incredible, high-performing System on Module (SoM) based on a powerful Rockchip RK3566 System on Chip (SoC). With a Quad-core Arm® Cortex®-A55 CPU and Arm Mali™-G52-2EE GPU, 2GB LPDDR4 RAM and 16GB eMMC storage, the CM3 will accelerate your design development and increase the performance and capabilities of your applications. ROCK CM3 benefits from multiple class-leading features, including wireless connectivity, such as WiFi® 5 and Bluetooth® 5.0, and extensive interface functionality, including audio and video interfaces, perfect for multimedia applications. Developed by OKdo Technology in collaboration with Radxa, the ROCK CM3 is an out-of-the-box, cost-efficient solution for any embedded applications.

Details

What are the key benefits of the ROCK 3 Compute Module (CM3)?

Out-of-the-box, cost-efficient solution

The CM3 will accelerate the development of your design applications.

Reliable and powerful SoC

Based on the Rockchip RK3566 System on Chip (SoC).

Perfect for multimedia applications

The CM3 benefits from an Arm Mali-G52-2EE graphic processing unit, audio and video interfaces, and an HDMI port supporting up to 4K x 2k@60Hz.

Perfect size for easy integration into different designs

Its compact size of just 55mm x 40mm allows it to be easily integrated into various embedded applications.

Flexible storage capacity

2GB LPDDR4 RAM and 16GB eMMC flash storage which can be used for OS and data storage.

Wireless connectivity

Practical SoM that offers several wireless connectivity opportunities, including WiFi 5, Bluetooth 5.0 with BLE and Gigabit Ethernet.

Multiple onboard interfaces

An extensive list of onboard interfaces allowing you to be highly flexible with applications of this compute module.

Interfaces:

• 802.11 b/g/n/ac Wireless LAN (Wi-Fi 5)
• Bluetooth 5.0 with BLE
• 8 x I2C
• 4 x SPI
• 8 x UART
• 9 x PWM
• 50 x GPIO
• 2 x ADC
• 1 x Gigabit Ethernet PHY
• Support PDM with microphone array
• I2S
• 2 x SATA
• 1 x PCIe 2.0, 1 lane host (5Gbps)
• 1 x USB 2.0
• 1 x USB 2.0 OTG
• 1 x USB 3.0 (5Gbps)
• 1 x SDIO 3.0
• 1 x HDMI up to 4K x 2k@60Hz
• 1 x eDP four lanes (2.7 Gbps per lane)
• 2 x MIPI DSI @ 1.6Gbps per lane
• 2 x MIPI CSI
• 1 x 2 lane MIPI CSI camera port
• 1 x 4 lane MIPI CSI camera port
• 1 x LVDS combo four lanes, mux with MIPI DSIO
• eMMC size: 16GB
• 3 x 100 pins 0.4mm pitch B2B connector

Kit Content:

• 1 x ROCK 3 Model A 2GB